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Keyence 3D Scanner CMM VL Series captures surface data and color information

March 21, 2019
Source: ASM International

Keyence, Itasca, Ill., has launched its new VL Series of 3D Scanner CMM, which provides a structured light scanner with full 360 degree measurement and claims fully traceable measurements of ±10 μm accuracy with 2 µm repeatability.

 

Objects can be scanned in 3D by simply placing them on the stage and clicking a button. Any measurements performed on the data set can be saved and applied automatically to other 3D scans for rapid analysis. Unlike conventional 3D scanners, the VL Series is able to collect both surface data and color information to generate a 3D image that accurately represents the scanned part. High and low magnification lenses are built-in standard, along with a large, high-resolution CMOS camera for capturing color and measurement data.

 

3D analysis can be performed on 3D shapes with complete flexibility. Once the data has been captured, measurements can be taken anywhere on the surface. In addition to standard measurements offered by conventional systems, the VL Series can also measure 3D shapes on the saved 3D scan. The system software allows geometrical evaluations for shape, position, and form.

 

When measuring an object, light from two sides is projected onto the surface and the stage is rotated to ensure that data is collected from all sides. The incident angle of the projected light maximizes the data received from areas that are difficult to reach with conventional 3D measuring instruments.

 

Two lenses allow either low or high magnification selection with a single click, according to the size of the measurement sample. Lenses with a higher depth of field are used, eliminating the need to change and calibrate the lens to match the field of view and with no need to adjust focus.

 

www.keyence.com

 

Subject Classifications

Industries and Applications | Electronics

Industries and Applications | Medical Devices

Industries and Applications | Nanotechnology

Materials Testing and Evaluation | Failure Analysis

Materials Testing and Evaluation | Microelectronic Failure Analysis

Materials Testing and Evaluation | Nondestructive Testing


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