Imina Technologies, Switzerland, is now the exclusive supplier of Electrical Failure Analysis solutions from point electronic GmbH, Germany.
Researchers from North Carolina State University have developed a new technique for creating simple electronic device components that proved effective in recent tests, indicating that self-assembly for more complex electronics, such as 3D computer chips, could be possible.
Synopsys, Inc., Sunnyvale, Calif., announced the industry’s first Ultra Ethernet IP and UALink IP solutions, including controllers, PHYs, and verification IP, to meet the demand for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnects.
Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
To address future energy needs, the Department of Energy Office of Science has announced the creation of three new Microelectronics Science Research Centers. One of these, the Microelectronics Energy Efficiency Research Center for Advanced Technologies (MEERCAT), will focus on energy efficiency by exploring solutions that integrate sensing, edge processing, artificial intelligence, and high-performance computing. Sandia […]
