The new Heat-Flex 7000 thermal insulative coating system from Sherwin-Williams Protective & Marine, Cleveland, Ohio, offers personnel protection, insulating capabilities and solar heat reflectivity for an array of industrial applications.
Researchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond, that has the highest breakdown voltage and lowest leakage current compared to previously reported diamond devices.
An international team, including researchers from Washington University in St. Louis, Massachusetts Institute of Technology, Yonsei University and Inha University in Korea, Georgia Institute of Technology, and the University of Notre Dame, has demonstrated the monolithic 3D integration of layered 2D material into novel processing hardware, addressing the challenge of increased information transfer time between functional components in advanced computer chips and paving the way for AI computing.
A research team at the University of Science and Technology of China of the Chinese Academy of Sciences developed a groundbreaking chemical method for two-dimensional metal-organic lattices.
Onsemi, Scottsdale, Ariz., opened an application test lab in Piestany, Slovakia, focused on the advancement of system solutions for battery/plug-in hybrid/electric vehicles and energy infrastructure power conversion systems.
