Amkor Technology, Inc., Tempe, Ariz., a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. announced a plan to jointly invest in European Semiconductor Manufacturing Company GmbH, in Dresden, Germany to construct a fab there and provide advanced semiconductor manufacturing services.
Candace Chan, an associate professor of materials science and engineering in the Ira A. Fulton Schools of Engineering at Arizona State University, Tempe, Ariz., is working on two projects to help alleviate problems in applications that use lithium-ion batteries, such as electric vehicles.
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A research team from Skoltech, Russia, has improved the properties of a polymer used in 3D printing by adding boron nitride “flakes” to the photopolymer, doubling the material’s thermal conductivity.
