Carl Zeiss Microscopy, Peabody, Mass., introduces the first system of the new Crossbeam 340 and 540 series FIB-SEMs for nanotomography and nanofabrication.
Zeiss 340 and 540 FIB-SEMs feature high-speed processing observed in real time
SUSS MicroTec launches projection scanner for advanced packaging
SUSS MicroTec, Germany, has launched the DSC300 Gen2 projection scanner, a platform for wafer sizes up to 300 mm based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).
Digital Catalog
Digital Catalog See what’s new with the digital edition of the ASM products catalog. Featuring the latest reference books organized by subject matter, this is a handy guide to ASM resources that can help you in your profession. Download the ASM 2026-2027 Catalog
Directed self-assembly developed to advance semiconductor manufacturing
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.
Oxide nanosheets enable capacitance with 2000 times higher stability
Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.