Advanced technologies are transforming industry, society, and people’s daily lives. Shelly Zhang, an NSF-supported researcher, discusses her work using additive manufacturing and topology optimization to create new structures, including a 3D thermal cloaking device.
DRAM master class: Wafer-fab-class process control in advanced packaging
In this video from Applied Materials learn why the industry now needs wafer-fab-class process control in advanced packaging.
How twisting two-dimensional materials led to a new field of research
Researchers from Rutgers University, MIT, and UT Austin, supported by the U.S. Department of Energy, have been awarded the Kavli Prize in Nanoscience for pioneering ‘twistronics’, discovering that twisting two-dimensional materials like graphene unlocks novel quantum behaviors like superconductivity.
New analog memory may make smart devices even smarter
Researchers at Sandia National Laboratories have developed electro-thermo-chemical random-access memory, a technology that uses localized heating and electrical pulses to store a range of analog values instead of binary ones and zeros, making future electronics more energy efficient.
Fraunhofer advances in-line packaging inspection with optical coherence tomography
Researchers at the Fraunhofer Institute for Ceramic Technologies and Systems, Germany, have developed an optical coherence tomography testing system that non-destructively detects seal defects in real time during film packaging processes.