Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.
With a 3D printed twist on an automotive icon, the Department of Energy’s Oak Ridge National Laboratory, Tenn., showcased additive manufacturing research at the 2015 North American International Auto Show in Detroit.
A research team led by North Carolina State University, Raleigh, made two advances in multiferroic materials, including the ability to integrate them on a silicon chip, which will allow the development of new electronic memory devices.
A new material presents efficient and degradation-resistant laser emission in the blue, a spectral region of interest in applications such as spectroscopy or materials processing, among others.
