Bruker Nano Surfaces, Billerica, Mass., has joined Sematech, Albany, N.Y., to develop new semiconductor defect characterization solutions for advanced materials development. The collaboration will generate the first detailed information database that allows Bruker’s patented PeakForce QNM mechanical force data to be correlated to nanoparticle materials.
Alcoa and VSMPO-AVISMA partner to produce aerospace aluminum and titanium
Alcoa, Pittsburgh, and VSMPO-AVISMA Corp., Russia, have agreed to join forces to meet growing demand for high-end titanium and aluminum products for aircraft manufacturers worldwide. Once formed, the joint venture will combine Alcoa’s expertise in manufacturing value-add products with VSMPO-AVISMA’s global leadership in titanium production to manufacture high-end aerospace goods, such as landing gear and forged wing components, at Alcoa’s plant in Samara.
Carnegie Mellon to develop next-gen silicon chips with $2.6 million NSF grant
Carnegie Mellon University’s Center for Silicon System Implementation, Pittsburgh, has received a $2.6 million grant from the National Science Foundation to develop next-generation ultra-efficient silicon chips that could trigger a revolution in how chips are designed and operated. The three-year initiative involves eight faculty members who have expertise in a variety of areas that include circuit design, computer architecture, and integrated circuit chip manufacturing.
IMS Members Named ASM Fellow
In 1969, ASM established the honor of Fellow of the Society to provide recognition to members for their distinguished contributions to materials science and engineering and to develop a broad based forum of technical and professional leaders to serve as advisors to the Society. We are pleased to announce the following IMS members will be among the 2013 inductees. Dr. Richard W.
XMC licenses semiconductor process technology from IBM
XMC, China, announces a licensing agreement with IBM under which XMC will license semiconductor process technology including underlying patents for several of IBM’s production-proven advanced manufacturing offerings. XMC has agreed to license both low power 65-nm RF and the 45-nm low power technology node. XMC will install the IBM process technologies in the second half of 2013 at its facilities in China. The current facility can be configured to produce up to 60,000 300mm wafers per month.