Tough, reusable adhesive can glue a variety of materials

Researchers at the Department of Energy’s Oak Ridge National Laboratory have developed a reusable adhesive made from waste polymers that is stronger than commercial glues, works in wet and dry conditions, and bonds materials ranging from wood and glass to metal and plastics. Inspired by mussels’ sticking power, the adhesive uses reversible chemical crosslinkers that […]

Terahertz microscope reveals the motion of superconducting electrons

MIT physicists have used a new imaging technique to observe terahertz-frequency vibrations—described as quantum “jiggles”—inside a superconducting fluid for the first time, revealing behavior that was previously undetectable. By shining terahertz light, which probes matter differently than optical, infrared or X-ray wavelengths, the team captured inherent quantum motions within the material, opening a new window […]

Tiny thermometers offer on-chip temperature monitoring for processors

Researchers at Penn State have developed a microscopic thermometer only one square micrometer across that can be integrated onto a chip to accurately track temperatures, using a new class of two-dimensional material known as bimetallic thiophosphates that had previously not been used in thermal sensors.

Applied Materials accelerates chip defect review with next-gen eBeam system

Applied Materials, Inc., Santa Clara, Calif., introduced a new defect review system to help semiconductor manufacturers continue pushing the limits of chip scaling combining the industry’s most sensitive electron beam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects.