Blacksmiths fire metals before hammering them, as heat always softens metal, making it more malleable and easier to reshape. Or does it? In a surprising new study, engineers from Northwestern University (Evanston, Ill.) discovered that, in extreme conditions, heat does not soften pure metals—it strengthens them.
Researchers at the U.S. Department of Energy’s Argonne National Laboratory have overcome a critical barrier in diamond-based electronics and microelectronics by using nanotechnology to integrate two-dimensional materials for efficient n-type doping, a breakthrough in electronic materials designed to operate in high-temperature environments and other harsh environments.
Governor Greg Abbott announced that a Texas Semiconductor Innovation Fund grant of $4,162,550 has been extended to Arm Inc. for an expansion of their Austin campus to include a new semiconductor lab with failure analysis capabilities.
Researchers at several Chinese institutions, led by the Chinese Academy of Sciences, have developed a 3D electrical imaging technique that enables direct observation of how charge moves through perovskite films.
Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program for their joint work in transforming chip design through AI-powered workflows.
