Researchers at the Fraunhofer Institute for Ceramic Technologies and Systems, Germany, have developed an optical coherence tomography testing system that non-destructively detects seal defects in real time during film packaging processes.
Researchers at the Department of Energy’s Oak Ridge National Laboratory have developed SimuScan, an artificial intelligence framework that uses realistic synthetic data to train AI to identify nanoscale features and autonomously target the most informative regions of a sample.
Hitachi High-Tech Corporation, Japan, established the Innovation Center Eindhoven at the High Tech Campus Eindhoven in the Netherlands.
Innovative Circuits Engineering Inc., San Jose, Calif., a leader in semiconductor reliability testing solutions, launched its latest innovation: the eM808 bHAST system—now enhanced with in-situ monitoring capabilities previously available only on high temperature operating life systems.
Penn State and Kurt J. Lesker Company have launched a strategic partnership to advance atomic-scale materials processing for semiconductors, advanced packaging, quantum technologies and photonics. Central to the collaboration is the new Kurt J. Lesker Company Atomic Scale Processing Center of Excellence, known as ASPIRE, at Penn State. The center will combine the company’s equipment […]
