Samsung Electronics Co. Ltd., Korea, has begun mass producing the industry’s first 10-nm class 8Gb DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.
Samsung mass produces first 10-nm class DRAM
Sandia National Laboratories licenses Invensas ZiBond and DBI electronic bonding technologies
Invensas Corp., San Jose, Calif., announces that Sandia National Laboratories has signed a new license agreement for ZiBond low-temperature homogeneous bonding technology and for Direct Bond Interconnect (DBI) technology, a low-temperature, hybrid bonding technology for integrated electrical interconnects.
ESD Alliance, Semico Research sign joint marketing agreement
The Electronic System Design (ESD) Alliance, San Jose, Calif., and Semico Research, Phoenix, Ariz., announce that they have entered into a joint marketing agreement to work together on several business initiatives in support of the semiconductor design ecosystem.
Amkor ships 700 million RF and advanced SIP modules for mobile devices
Amkor Technology Inc., Tempe, Ariz., announces that it has shipped 700 million RF and front-end advanced system-in-package (SIP) modules for mobile device applications.
Software enables automated reporting of surface analyses from 3D optical microscopes
Bruker Corp., San Jose, Calif., and Digital Surf, France, announce that Bruker Nano Surfaces is offering Vision64 Map data analysis and reporting software, which enables streamlined access to automated reporting of advanced surface measurements in 11 languages, while ensuring compatibility across a wide range of industry standards.