The new inter-die gapfill tool from Lam Research Corp., Fremont, Calif., expands industry-leading portfolio of solutions for 3D integration and chiplet technologies; paves way for new, AI-accelerating architectures.
A new perspective article from NIST and collaborators highlights a critical but often underrated piece of the semiconductor revolution: the “soft” polymer-based packaging materials that hold advanced chips together that are emerging as important factors for reliability, performance, and cost.
Exosens, France, extends its technology portfolio by signing an agreement to acquire Phasics, France, leader in high performance cameras based solutions for optical metrology.
The NASA Laboratories, Development and Testing Division provides science and engineering services to NASA programs and projects, contractor partners, and external customers such as other government agencies, aerospace companies, and academia.
Flaws in the pool deck are thought to be the preliminary cause of the devastating collapse of a condominium in Surfside, Florida, that killed 98. Recent test results by the National Institute of Standards and Technology (NIST), the agency leading the investigation of the 2021 tragedy, reinforces the theory that the failure started in the pool deck area rather than in the tower itself. NIST released new findings this week.
