A team of researchers from the University of Kassel in Germany used microspheres placed directly on an object’s surface to extend the limits of interferometric topography measurements for optical resolution of small structures.
By modifying an existing technique for identifying defects, researchers at the National Institute of Standards and Technology, Gaithersburg, Md., have developed a method that can simultaneously locate individual electrical flaws in multiple microcircuits on the same chip.
Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., developed a new technique that accelerates the solving of material structures from patterns uncovered in x-ray experiments.
Leading semiconductor test equipment supplier Advantest Corp., Japan, announced the latest addition to its extended power supply card series: the DC Scale XPS128+HV, developed to lower the cost of testing for power management ICs and other high-voltage devices.
Atomica Corp, Santa Barbara, Calif., a leader of micro-electro-mechanical systems, raised $30 million in Series C financing.
