Samco, Japan, launched the new AD-800LP plasma enhanced atomic layer deposition system targeting gate oxide film deposition for next-generation power devices of silicon carbide and gallium nitride materials.
Zeiss Semiconductor Manufacturing Technology is building a new multifunction factory in Dillfeld, Wetzlar, Germany, in addition to the existing SMT site.
Edax, Pleasanton, Calif., a leader in x-ray microanalysis and electron diffraction instrumentation, launched the Velocity Ultra, a new, faster, low-noise CMOS camera to its Velocity Electron Backscatter Diffraction Camera Series, now the fastest EBSD camera in the world.
Researchers at Northeastern University, Boston, discovered an all-ceramic material that can be compression-molded into complex parts—an industry breakthrough— that could transform the design and construction of heat-emitting electronics, including cellphones and other radio components.
Cadence, Santa Clara, Calif., rolled out Verisium, its latest AI-powered electronic design automation (EDA) platform which promises to ease the amount of time and resources that chipmakers put into the verification process.
