Oxford Instruments validates contactless SiC plasma epi-prep on power devices with technology acceleration partner Clas-SiC

Oxford Instruments, UK, who recently launched its SiC substrate contactless plasma polishing solution to supersede the established chemical mechanical planarization process with a clean, dry, lower cost, higher yield, and sustainable alternative, announced it qualified whole wafer 1200V MOSFET devices with the process collaborating with Clas-SiC, further boosting confidence in the new solution and its impact on SiC power semiconductor devices.

Roboze invests in the future of super materials

Roboze has started the construction of a cutting-edge laboratory dedicated to the development of future super materials. The new facility, located in Bari, Italy, will aim to accelerate the transition to sustainable manufacturing.

Intriguing material property found in complex nanostructures could dissipate energy

The phenomenon in question is called anelasticity. It relates to how materials react to stresses over time. When the materials studied in this paper were bent, tiny defects moved slowly in response to the stress gradient. When the stress is released, the tiny defects slowly return to their initial positions, resulting in the anelastic behavior.