3D-Micromac AG, Germany, introduced microPREP L, a laser-based sample prep system that supports up to whole 12-inch wafers and system-level boards, enabling fast, precise, reproducible, and non-destructive material removal for semiconductor failure analysis and quality assurance.
A research team led by National Institute for Materials Science, Japan, has, for the first time, produced nanoscale images of two key features in an ultra-thin material: twist domains (areas where one atomic layer is slightly rotated relative to another) and polarities (differences in atomic orientation) by combining scanning transmission electron microscopy with artificial intelligence.
Researchers at the Fraunhofer Institute for Integrated Circuits IIS, Germany, are developing an open-source tool to enhance the prevention of radiation-induced functional degradation in electronic systems.
NVIDIA, Santa Clara, Calif., and Samsung, South Korea, are building a new AI factory with 50,000 NVIDIA GPUs to accelerate agentic and physical AI applications for advanced chip manufacturing, mobile devices, and robotics.
By studying the theoretical limits of how light can be used to perform computation, Cornell researchers have uncovered new insights and strategies for designing energy-efficient optical computing systems.
