May 2022 Issue of Electronic Device Failure Analysis, a quarterly publication providing a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers.
A ribbon cutting event was held at the Zeiss Microscopy Customer Center Bay Area (ZMCC BA), housed within the Zeiss Innovation Center California, a high-tech building designed to promote customer and employee collaboration, in Dublin, Calif., on April 17 at 11:30 a.m. PDT. The event was live streamed from the ZMCC BA facility.
A team of researchers affiliated with multiple institutions in China and the U.S. has found that it is possible to track the sliding of grain boundaries in some metals at the atomic scale using an electron microscope and an automatic atom tracker. In their paper published in the journal Science, the group describes their study of platinum using their new technique.
The materials scientists from University of Freiburg, Dr. Frederik Kotz-Helmer and Professor Bastian E. Rapp, in collaboration with the University of California at Berkeley, have come up with a novel process that could be used to rapidly and accurately generate very small components from transparent glass with the help of micro 3D printing.
Superconductors are attractive for many applications such as loss-less power cables, electric motors and generators, as well as powerful electromagnets that can be used for MRI imaging and for magnetic levitating trains. Now, researchers have detailed the superconducting nature of a new class of superconducting material, magic-angle twisted bilayer graphene.
