Ultratech Inc., Waltham, Mass., announces that it has moved Ultratech/Cambridge NanoTech to Waltham, where a new state-of-the-art facility will expand its operations for next-generation atomic layer deposition (ALD) equipment development and enable leading-edge scientific research. After acquiring the assets of Cambridge NanoTech last December, Ultratech invested in the new facility to enhance ALD development.
U.S. Steel introduces coated steel sheet with chromium-free clear emissive polymer coating
United States Steel Corp., Pittsburgh, introduces Acrylume E Plus, a coated flat-rolled steel that has a chromium-free clear emissive polymer coating, and provides all of the quality and performance attributes of Acrylume, with improved thermal emittance. As with Acrylume and Acrylume CF, Acrylume E Plus minimizes staining and discoloration during storage, handling, and installation, and both products can be used in the same end-use applications.
Laser spike anneal system enables precise control of gases around the wafer
Ultratech Inc., San Jose, Calif., has shipped its first LSA201 laser spike anneal system to a leading integrated device manufacturer. The LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing. At the customer’s facility, the system will be used to develop leading-edge logic technology, mainly focusing on FinFETs.
ASB to modernize its Mesta roll grinder
ASB Industries, Barberton, Ohio, announces that its Heavy Duty Grinder, which is five feet in diameter and 24 feet long, will be modernized at a cost of approximately $400,000. Rebuild will begin in June and is expected to take approximately six months. This major capital investment will allow two-axis grinding for complex roll crowns with extreme accuracy and efficiency. Thermal Spray surfacing materials require different grinding media to achieve critical surface finishes.
Mentor Graphics 3D-IC flow solutions validated for true 3D stacking integration
Mentor Graphics Corp., Wilsonville, Ore., announces that its 3D-IC flow solutions have been validated by TSMC with a true 3D stacking test vehicle for TSMC’s 3D-IC Reference Flow. The flow expands support from silicon interposer offerings to include TSV-based, stacked die designs.