Henkel, Germany, released a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
Lam Research Corp., Fremont, Calif., introduced the world’s first production-oriented pulsed laser deposition tool to enable next-generation MEMS-based microphones and radio frequency filters.
Hexagon’s Manufacturing Intelligence division, Sweden, launched the first optical 3D scanner on the market with a motorized zoom lens that enables users to adjust data resolution and measurement volume entirely through software settings.
The May 2024 issue of Electronic Device Failure Analysis includes: SThM for Localizing and Monitoring Defects; MicroStructural Hierarchy Descriptor for MFA; Electro-Thermal Simulation and Reliability of a BGA; and Differential Laser Voltage Probe Overview.
This video from Multi-Scale Robotics Lab at ETH Zurich demonstrates variable stiffness catheters. They are typically composed of an encapsulated core made from a low melting point alloy or a thermoplastic polymer.
