The Air Force Rapid Sustainment Office Advanced Manufacturing Program Office’s Part Assessment and Cost Tool officially went live on Air Force Cloud One, the first Advanced Manufacturing application to do so.
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2D material reshapes 3D electronics for AI hardware
An international team, including researchers from Washington University in St. Louis, Massachusetts Institute of Technology, Yonsei University and Inha University in Korea, Georgia Institute of Technology, and the University of Notre Dame, has demonstrated the monolithic 3D integration of layered 2D material into novel processing hardware, addressing the challenge of increased information transfer time between functional components in advanced computer chips and paving the way for AI computing.






