TESTING CD & DVD
Technology advance could expand the reach of 3D nanoprinting
Chinese researchers have developed an easy-to-build, low-cost 3D nanoprinting system that can create arbitrary 3D structures with extremely fine features, precise enough to print metamaterials as well as a variety of optical devices and components such as microlenses and micro-optical devices.
Advantest rolls out thermal control products for MPT3000 solid-state drive test platform
Advantest Corporation, Japan, announced two new additions to its MPT3000 solid-state drive test platform.
Amkor advanced packaging enables the car of the future
Amkor Technology, Inc., Tempe, Ariz., a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.
TSMC, Bosch, Infineon, and NXP establish joint venture to bring advanced semiconductor manufacturing to Europe
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. announced a plan to jointly invest in European Semiconductor Manufacturing Company GmbH, in Dresden, Germany to construct a fab there and provide advanced semiconductor manufacturing services.