FEI Co., Hillsboro, Oregon, announces that the latest technological innovations of the Helios G4 CX plasma-focused ion beam instrument, in combination with comprehensive software and FEI’s application expertise, allow Helios G4 CX with optional AS&V4 software to acquire the highest-quality multi-modal 3D datasets.
Analog Devices Inc., Norwood, Mass., and Linear Technology Corp., Milpitas, Calif., announce that they have entered into a definitive agreement under which Analog Devices will acquire Linear Technology in a cash and stock transaction that values the combined enterprise at approximately $30 billion.
Applied Materials Inc., Santa Clara, Calif., announces that its next-generation ProVision e-beam wafer inspection system delivers the highest resolution and image quality at the fastest throughput to foundry, logic, DRAM, and 3D NAND customers as they move to advanced nodes.
Semiconductor Research Corp., Durham, N.C., announces that Tokyo Electron Limited has joined SRC’s Nanomanufacturing Materials and Processes initiative.
Mentor Graphics Corp., Wilsonville, Ore., announces the first phase of the new Xpedition printed circuit design flow to address the increasing complexity of today’s advanced systems.
