Hitachi High Technologies America Inc., Schaumburg, Ill., has released the FlexSEM 1000, a compact SEM system with a minimized, lab-friendly footprint, 6 to 100 Pa variable pressure, and 4 nm resolution, while offering superior ease of use for operators of all skill levels.
Mentor Graphics Corp., Wilsonville, Ore., announces that its Valor Production Plan software has been certified by SAP as powered by the SAP NetWeaver technology platform, streamlining PCB assembly planning, including surface mount technology, manual assembly, and test.
Cadence Design Systems Inc., San Jose, Calif., announces that Tezzaron Semiconductor has adopted the Cadence full-flow digital register-transfer level (RTL)-to-signoff solution for its networking and supercomputing system on chips, cutting its development schedules in half.
Lindberg/MPH, Riverside, Mich., announces the shipment of a cyclone pit furnace for heat treating aircraft components to a supplier of the aerospace industry.
Superior Tube Company Inc., Collegeville, Pa., has been awarded Nadcap accreditation for heat treating by the Performance Review Institute.
