Argonne National Laboratory, Lemont, Ill., announces that it has been granted a patent for its ultra-fast boriding process.
Argonne receives patent for ultra-fast boriding process, Bodycote acquires license
Applied Materials introduces high-performance ALD technology for 3D thin film devices
Applied Materials Inc., Santa Clara, introduces the Applied Olympia ALD (atomic layer deposition) system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.
Materion doubles capacity for ToughMet CuNiSn alloys
Materion Performance Alloys, Mayfield Heights, Ohio, has more than doubled its capacity to produce foil gauge ToughMet alloys that are used to make the company’s BrushForm 158 copper-nickel-tin alloy strip product line.
Black phosphorus may replace silicon in future devices
Researchers at the Center for Integrated Nanostructure Physics at Sungkyunkwan University, South Korea, report that they have developed a high-performance transistor made of black phosphorus (BP).
Chinese company to bid for Micron Technology
China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, San Diego, in what some say would be the biggest Chinese takeover of a U.S. company.