Sony Semiconductor Solutions, Japan, and imec, Belgium, have unveiled a high-density “local BDI” module for 3D chip stacking that allows through-silicon vias to connect through up to 500nm of bulk silicon, unlocking advanced logic and DRAM applications without needing to completely remove the silicon.
Materials scientists at Rice University, Houston Texas, have developed a custom Python-based software tool that uses high-resolution X-ray diffraction to rapidly analyze microscopic defects and calculate dislocation density in diamond and other advanced semiconductor materials.
Japan’s Shimadzu Corporation fully acquired Czech electron microscopy pioneer Tescan, marking an important milestone in Tescan’s continued growth and evolution.
Northeast Ohio has been selected as one of 12 National Science Foundation Regional Innovation Engines, making the region eligible for up to $160 million in funding over the next decade to advance manufacturing through materials research, artificial intelligence and workforce development. Led by Case Western Reserve University, the NEO-SMART coalition includes more than 70 partners […]
Researchers at The University of Manchester found that small temperature variations during molten metal deposition, a metal 3D-printing process, can have a significant impact on the quality of aluminum components. The study showed that carefully controlling thermal conditions during printing can reduce microscopic defects and improve the material’s grain structure, helping produce stronger, higher-quality parts […]
