Invensas, San Jose, Calif., a wholly owned subsidiary of Xperi Corp., announces the successful technology transfer of its Direct Bond Interconnect to Teledyne DALSA, a Teledyne Technologies company.
Olympus Scientific Solutions Corp., Waltham, Mass., announces that the MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples.
Hirox-USA, Hackensack, N.J., introduces the RH-2000 3D digital microscope, which features high-performance lenses with incorporated zoom technologies, built-in illumination, and precision mechanisms.
Rudolph Technologies, Flanders, N.J., introduces the NSX 330 Series, which combines defect inspection with 2D and 3D metrology.
The National Academy of Inventors, Washington, D.C., announces that Prof. Zhigang Zak Fang has been elected to the rank of NAI Fellow.
