SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.
SUSS MicroTec launches automated permanent wafer bonding system
Taiwan Semiconductor to join SRC project to optimize materials and processes
Semiconductor Research Corp. (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.
Taiwan Semiconductor to join SRC project to optimize materials and processes
Semiconductor Research Corporation (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.
Mentor Graphics joins Siemens lifecycle management software business
Siemens AG, Munich, announces the recent closing of its acquisition of Mentor Graphics Corp., Wilsonville, Ore., which is now part of Siemens’ product lifecycle management software business.
Semiconductor Industry Association reports global sales up 16.5% year-to-year
The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $30.4 billion for the month of February 2017, an increase of 16.5% compared to the February 2016 total of $26.1 billion.