Bruker, Billerica, Mass., introduces the SkyScan 1275, a high-speed X-ray microtomography benchtop system specially designed for fast scanning using new advances in the technology of X-ray sources and efficient flat-panel detectors.
Materion Corp., Mayfield Heights, Ohio, announces that it has acquired the target materials business of the Heraeus Group to strengthen its position in precious and non-precious target materials for the semiconductor, architectural and automotive glass, photovoltaic, and display markets.
The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9% compared to the January 2016 total of $26.9 billion.
Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip’s internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.
Entering service with the United States Air Force in 1997, the Northrop Grumman-engineered B-2 Spirit is a multi-role heavy bomber designed to penetrate anti-aircraft defenses undetected.
