Researchers from North Carolina State University, Raleigh, and the U.S. Army Research Office, White Oak, Md., developed a way to integrate novel functional materials onto a computer chip to create new smart devices and systems.
Tenova Core Inc., Coraopolis, Pa., announces that Thomas V. Bovalina, previously its Chief Operating Officer, has assumed the position of Tenova Core’s President and CEO.
Harper International, Buffalo, N.Y., has been selected by a leading Asian electronic components firm for the design of two high-temperature elevator furnaces for its production plant.