Paulo Products Co., St. Louis, Mo., announces that its Kansas City Division is now AS9100 certified, and joins the Cleveland Division in being both AS9100 certified and Nadcap accredited.
Paulo Products Kansas City Division becomes AS9100 certified
Solar partners with Refrac to build system for superplastic forming/diffusion bonding
Solar Manufacturing, Souderton, Pa., announces that it has contracted with Refrac Systems, Chandler, Ariz., to help design and build a large 100-ton-load gas fan quench vacuum hot press (GFQVHP) system for its aerospace structures diffusion bonding operation.
Jeol Neoscope SEM enables rapid inspection of electronics
Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.
Cadence develops design and analysis solution for wafer-level chip scale packaging
Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.
Oxford Instruments Aztec One XT software platform simplifies EDS analysis
Oxford Instruments, has launched the Aztec One XT system, an ideal solution for those who want to perform a complex task such as EDS as quickly and as easily as possible.