Peregrine Semiconductor Corp., San Diego, has shipped the first RF switches built on the UltraCMOS 10 technology platform.
Peregrine Semiconductor ships first UltraCMOS 10 RF switrch production units
Indium SACm solder paste increases device drop-shock resistance by 800%
Indium Corp., Utica, N.Y., has developed SACm, a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling.
Applied Materials tool encapsulates copper interconnects in cobalt films
Applied Materials Inc., has developed its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.
Georgia Tech PRC and Finetech demonstrate copper Interconnects without solder
Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.
Sematech achieves zero defects per mask at 100 nm sensitivity in deposited EUV multilayers
Sematech, Albany, N.Y., announces that its researchers have reached a significant milestone in reducing to zero the defects generated by tools from the multi-layer deposition of mask blanks for extreme ultraviolet lithography.