SUSS MicroTec, Germany, has launched the DSC300 Gen2 projection scanner, a platform for wafer sizes up to 300 mm based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).
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Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.
Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.
Researchers at the University of California Riverside, and the University of Manchester, U.K., report that that a sandwich made of graphene on both sides of a sheet of copper improves the copper’s ability to dissipate heat by 25%.
