Phoenix Temperature Measurement, Clearwater, Fla., announces that a major steel coil manufacturer has taken delivery of a ‘hot box’ system to monitor the temperature of steel wire coils through their annealing process.
Paulo Products Co., St. Louis, Mo., announces that its Kansas City Division is now AS9100 certified, and joins the Cleveland Division in being both AS9100 certified and Nadcap accredited.
Solar Manufacturing, Souderton, Pa., announces that it has contracted with Refrac Systems, Chandler, Ariz., to help design and build a large 100-ton-load gas fan quench vacuum hot press (GFQVHP) system for its aerospace structures diffusion bonding operation.
Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.
Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.
