ThyssenKrupp Aerospace, Germany, has moved to a new building at Vitrolles near Marseille, France, mainly dedicated to supporting a major customer in the area. The company will stock materials such as aluminum, titanium, copper, and steel in bars, plates, sheets, rounds, and more. The Vitrolles facility will manage over 20,000 working orders per year, about half of which will be prefabricated in-house prior to shipment.
Understanding How Components Fail, 3rd Edition, Donald J. Wulpi, edited by Brett Miller ASM International, Materials Park, Ohio, is pleased to announce the release of Understanding How Components Fail, 3rd Edition. The 310 page publication adds recent technical knowledge and analysis including the addition of fatigue striation counting, modeling and crack rate prediction; Microbiologically Influenced Corrosion (MIC) failures; and elevated temperature updates.
Ultratech Inc., Waltham, Mass., announces that it has moved Ultratech/Cambridge NanoTech to Waltham, where a new state-of-the-art facility will expand its operations for next-generation atomic layer deposition (ALD) equipment development and enable leading-edge scientific research. After acquiring the assets of Cambridge NanoTech last December, Ultratech invested in the new facility to enhance ALD development.
United States Steel Corp., Pittsburgh, introduces Acrylume E Plus, a coated flat-rolled steel that has a chromium-free clear emissive polymer coating, and provides all of the quality and performance attributes of Acrylume, with improved thermal emittance. As with Acrylume and Acrylume CF, Acrylume E Plus minimizes staining and discoloration during storage, handling, and installation, and both products can be used in the same end-use applications.
Ultratech Inc., San Jose, Calif., has shipped its first LSA201 laser spike anneal system to a leading integrated device manufacturer. The LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing. At the customer’s facility, the system will be used to develop leading-edge logic technology, mainly focusing on FinFETs.
