See how the National Laboratory of the Rockies uses the ARIES platform to demonstrate how integrated energy resources can reliably power large, unpredictable loads like data centers, AI, and crypto facilities on the modern electric grid.
Advantest and Tokyo Seimitsu announce joint development of die-level prober
Advantest Corporation, Japan, and Tokyo Seimitsu Co., Ltd. announce plans to co-develop a new die-level prober, designed for the testing of high-performance computing devices.
Detecting ‘hidden defects’ that degrade semiconductor performance with 1,000X higher sensitivity
A joint research team at the Korea Advanced Institute of Science and Technology and IBM T. J. Watson Research Center, Yorktown Heights, N.Y., has developed a new analysis method that can detect “hidden defects” in semiconductors, electronic traps that interfere with electrical flow, with approximately 1,000 times higher sensitivity than existing techniques.
New sensor measures strain, strain rate, and temperature with single material layer
Researchers from the Institute of Metal Research of the Chinese Academy of Sciences have developed an innovative flexible sensor that can simultaneously detect strain, strain rate, and temperature using a single active material layer, representing a significant advance in multimodal sensing technology.
New nanoprobing platform for high voltage applications
Imina Technologies SA, Switzerland, released a new Nanoprobing High-Voltage Platform designed to safely apply voltages up to 1 kV through both nanoprobing tips and the backside of the sample, addressing the growing need for reliable electrical characterization of wide-bandgap and high-power semiconductor devices such as SiC- and GaN-based MOSFETs, IGBTs, and other devices.