Researchers from the University of Illinois Urbana-Champaign, in collaboration with Sandia National Laboratories and Bucknell University, have found that insight from muscovite mica and earthquake statistics can help quantify how hostile environmental interactions impact the degradation of materials used in advanced solar panels, geological carbon sequestration, and infrastructure.
A new report from the National Academies of Sciences, Engineering, and Medicine, Washington, D.C., analyzes the causes of the 2020 collapse of the National Science Foundation’s telescope at the Arecibo Observatory in Puerto Rico, where NSF maintained research operations for its National Astronomy and Ionosphere Center, and draws lessons learned for other unique, critical science facilities.
Thermo Fisher Scientific, Waltham, Mass., has highlighted the ability of scanning electron microscopy to successfully capture defects when conducting failure analysis on metals.
In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
