This video from Taylor Sparks dives into the revolutionary discovery of high entropy alloys (HEAs) that revitalized the field of metallurgy.
Amkor signs preliminary memorandum of terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology Inc., Tempe, Ariz., signed a preliminary agreement with the U.S. Department of Commerce for up to $400 million in funding under the CHIPS and Science Act to create a new $2 billion semiconductor packaging facility in Peoria, Arizona, the largest outsourced advanced packaging and test facility in the United States, generating approximately 2,000 jobs.
Oxford Instruments completed acquisition of FemtoTools AG
Oxford Instruments plc, United Kingdom, a leading provider of high technology products and services to industry and scientific research communities, completed the acquisition of FemtoTools AG, Switzerland. The acquisition was first announced on 11 June 2024, and has been completed following the satisfactory conclusion of closing conditions. FemtoTools specializes in measuring and imaging the properties […]
Kyocera introduces cutting-edge Peltier module with 21% increase in cooling performance
Kyocera Corporation, Japan, launched a new Peltier (thermoelectric) module that boasts a maximum heat absorption rate 21% higher than its conventional products, significantly enhancing cooling performance for applications such as automotive battery and seat temperature control.
Argonne, Purdue University explore collaborations to advance next-generation microelectronics
The U.S. Department of Energy’s Argonne National Laboratory joined with Purdue University, West Lafayette, Ind., to identify collaborative areas in technology and research as a springboard for new joint microelectronics projects, taking a multidisciplinary approach to studying everything from materials and devices to software and manufacturing techniques.