Lasertec U.S.A., San Jose, Calif., introduces the WASAVI Series BGM300. This instrument measures silicon wafer thicknesses and TSV depths prior to back grinding 3D semiconductor devices.
Bruker Nanosurfaces Division, Billerica, Mass., introduces the Dektak XTL Stylus Profiler, extending its stylus profilometry capabilities to 200 and 300 mm semiconductor wafer fabs and next-generation touch panel manufacturers.
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., has launched a new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).
Cadence Design Systems, Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.
Imec, Belgium, celebrates its 30th anniversary. Founded in 1984 as a non-profit organization, it has enabled notable advancements in global semiconductor chip manufacturing in the three decades since its founding.
