Researchers at Xi’an Jiaotong University, China, have developed a new Template-Constrained Additive printing technology inspired by tree root systems that enhances the mechanical robustness and precision of flexible electronic circuits, allowing them to withstand extreme conditions like high temperatures and mechanical wear, expanding their applications in smart robotics and advanced sensing systems.
Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronics.
Researchers at the University of New South Wales, Australia, have created a protective barrier on the front silver grid of a TOPCon solar cell using a 1 µm copper plating layer, which reduces corrosion susceptibility and significantly lowers contaminant-induced degradation compared to unprotected reference devices.
Semiconductor test equipment supplier Advantest Corporation, Japan, announced the T5801 Ultra-High-Speed DRAM Test System to support the latest advancements in high-speed memory technologies —including GDDR7, LPDDR6, and DDR6— critical to meeting the growing demands of artificial intelligence, high-performance computing, and edge applications.
Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
