Thermo Fisher Scientific, Waltham, Mass., has highlighted the ability of scanning electron microscopy to successfully capture defects when conducting failure analysis on metals.
In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
NenoVision, Czech Republic, a leading innovator in advanced microscopy solutions, has been honored with the esteemed R&D 100 Award in the Analytical/Test category for its AFM-in-SEM LiteScope technology.
Photonics Management Corp., Bridgewater, N. J., a subsidiary of Hamamatsu Photonics K.K., Japan, has purchased the stock of BAE Systems Imaging Solutions, Inc. a subsidiary of BAE Systems, Inc., Falls Church, Va.
