Building something as large as a 737 wing takes an even bigger machine.
How to Build the Wings for the Boeing 737
Oxford Instruments develops SiC via etch for RF devices
Oxford Instruments, Concord, Mass., announces that it has developed a silicon carbide via plasma etch process based on its PlasmaPro100 Polaris etch system.
Qualcomm Technologies opens semiconductor test facility in Shanghai
Qualcomm Inc., San Diego, announces the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the WGQ free-trade zone in Shanghai, and its first venture into providing manufacturing services for semiconductors.
Linde invests $5.4 million in Taiwan R&D Center
The Linde Group, Murray Hill, N.J., has invested approximately $5.4 million to establish a Linde Electronics R&D Center in Taiwan to support local customers and development partners with its state-of-the-art analytical and product development laboratory.
Applied Materials extends R&D partnership with Singapore’s Institute of Microelectronics
Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, Singapore, announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.