Amkor Technology Inc., Tempe, Ariz., announces completion of product qualification for its innovative silicon wafer integrated fan-out technology, which is designed to handle the demanding requirements of today’s advanced mobile, networking, and system-in-package applications.
Bruker AXS, Billerica, Mass., introduces the D8 Advance Plus as the newest member of the D8 Advance family of X-ray diffraction (XRD) solutions.
Imec, Belgium, has shown for the first time that a silicon-passivated germanium nMOS gate stack with reduced interface defect density reaches the same defect level as a silicon gate stack, and has high mobility with reduced positive bias temperature instability.
University of Twente, Netherlands, reports that scientists from its MESA+ research institute have developed a method for studying individual defects in transistors.
Global Wafers Co. Ltd., Taiwan, announces that its acquisition of SunEdison Semiconductor, St. Peters, Mo., has been successfully completed.
