Qualcomm Inc., San Diego, announces the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the WGQ free-trade zone in Shanghai, and its first venture into providing manufacturing services for semiconductors.
The Linde Group, Murray Hill, N.J., has invested approximately $5.4 million to establish a Linde Electronics R&D Center in Taiwan to support local customers and development partners with its state-of-the-art analytical and product development laboratory.
Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, Singapore, announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.
SEMI, San Jose, Calif., recently completed its annual silicon shipment forecast for the semiconductor industry, providing an outlook for the demand in silicon units for the period 2016–2018.
Toshiba America Electronic Components Inc., Irvine, Calif., has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions.
