Researchers at the University of Illinois Urbana-Champaign discovered that ordered defect pairs in solution-deposited semiconductors lead to record-high transistor performance, challenging conventional wisdom in semiconductor manufacturing.
The November 2024 issue of Electronic Device Failure Analysis includes: Celebrating 50 Years of ISTFA; Four-dimensional STEM: Part III, Ptychography; Nondestructive 3D X-ray Microscopy Speeds Throughput; Specimen Thinning by Argon Ion Beam Milling; and TEM Samples with PFIB and STEM EBIC.
This video from UNL Astronomy describes the phase changes for shape memory alloys.
The different effects of steel composition on the dimensional change of plates made of ledeburitic cold-work tool steels and a working hardness of 61 HRC can be taken from the figure. Typical representatives of the new generation of improved toughness 8-9%Cr-steels show slightly higher growth in dimension than the classical 12%Cr-D2 steel. The growth in […]
Wisconsin Oven, East Troy, WI, has announced the shipment of a gas-fired walk-in batch oven to a prominent manufacturer in the defense industry. The oven is designed for curing filament wound composite materials and is capable of processing a 78,000-pound load on a 40-foot long mandrel carried by a load car. The work chamber measures […]
