Chinese researchers have developed an easy-to-build, low-cost 3D nanoprinting system that can create arbitrary 3D structures with extremely fine features, precise enough to print metamaterials as well as a variety of optical devices and components such as microlenses and micro-optical devices.
Advantest Corporation, Japan, announced two new additions to its MPT3000 solid-state drive test platform.
Amkor Technology, Inc., Tempe, Ariz., a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. announced a plan to jointly invest in European Semiconductor Manufacturing Company GmbH, in Dresden, Germany to construct a fab there and provide advanced semiconductor manufacturing services.
Candace Chan, an associate professor of materials science and engineering in the Ira A. Fulton Schools of Engineering at Arizona State University, Tempe, Ariz., is working on two projects to help alleviate problems in applications that use lithium-ion batteries, such as electric vehicles.
