NVIDIA NeuralVDB brings AI and GPU optimization to OpenVDB

  Video description See how NVIDIA expanded the capabilities of OpenVDB with the power of AI creating compact neural representations with up to 100x reduction in memory footprint for simulating smoke, clouds, and other sparse volumetric data.

DARPA Innovation Fellowship

DARPA, Arlington, Va., is accepting applications for its Innovation Fellowship, a two-year position for early career scientists and engineers.

Oxford Instruments validates contactless SiC plasma epi-prep on power devices with technology acceleration partner Clas-SiC

Oxford Instruments, UK, who recently launched its SiC substrate contactless plasma polishing solution to supersede the established chemical mechanical planarization process with a clean, dry, lower cost, higher yield, and sustainable alternative, announced it qualified whole wafer 1200V MOSFET devices with the process collaborating with Clas-SiC, further boosting confidence in the new solution and its impact on SiC power semiconductor devices.