Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.
The world’s fastest microscope makes its debut
Purdue’s Chipshub wins NSF award for Chip Design Hub to help ease urgent national semiconductor workforce shortage
The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.
Solid-state batteries get a boost with new protective coating
Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., have developed a method to coat sulfide-based solid electrolytes, finding a thin, glass-like layer could be the key to longer-lasting, cost-effective solid-state batteries.
Lam Research introduces VECTOR TEOS 3D to address critical advanced packaging challenges in chipmaking
The new inter-die gapfill tool from Lam Research Corp., Fremont, Calif., expands industry-leading portfolio of solutions for 3D integration and chiplet technologies; paves way for new, AI-accelerating architectures.
The “soft side” of chips: NIST advances polymer science for semiconductor packaging
A new perspective article from NIST and collaborators highlights a critical but often underrated piece of the semiconductor revolution: the “soft” polymer-based packaging materials that hold advanced chips together that are emerging as important factors for reliability, performance, and cost.