May 2014 Issue of Electronic Device Failure Analysis, a quarterly publication providing a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers.
SSAB, Sweden, reports that both its Hardox and Domex high-strength steels meet all demands for laser cutting and can be processed with the same cutting parameters as unalloyed steel grades such as S235.
Olympus Corp., Center Valley, Pa., has developed the 27MG Ultrasonic Thickness Gage for accurate measurements from one side of internally corroded or eroded metal pipes and structures.
The Purdue University School of Materials Engineering, West Lafayette, Ind., has chosen Rick Sisson, WPI Professor and Director of CHTE (Center for Heat Treating Excellence), as one of three 2014 Outstanding Materials Engineers.