GE Aviation, Cincinnati, will invest $27 million to develop advanced manufacturing methods for ceramic matrix composites at its plant in Newark, Del. Engineers at GE Global Research designed machines that coat the ceramic fibers, compress the fibers into tapes, and mold the tapes into shaped panels that are then fused in a furnace. The process can produce parts such as turbine shrouds, combustor liners, turbine blades, and fairings.
The National Institute of Standards and Technology (NIST) is awarding $5 million to the National Additive Manufacturing Innovation Institute (NAMII) in Youngstown, Ohio, which is operated by the National Center for Defense Manufacturing and Machining, for a three-phase collaborative research effort involving 27 companies, universities, and national laboratories.
Ambrell Inc., Scottsdale, N.Y., is exhibiting its Easyheat induction heating system with robotics from Nutek Industrial Systems, Broadview Heights, Ohio, at the Heat Treat Expo. Additionally, tooling from Induction Tooling (ITI) will be on display in booth 2102, and a newly designed modular Ekoheat will be exhibited. The Ekoheat line now offers power up to 1.2 MW, enabling the product line to address higher power heat treating applications.
MSC Software Corp., Newport Beach, Calif., announced the new release of Marc 2013.1 which provides engineers with faster nonlinear finite element analysis (FEA) with new modeling options and increased ease of use. Performance improvements that take advantage of the modern multi-core processors are implemented. This may be used in conjunction with domain decomposition (DDM) and/or the parallel solution of equations of motion.
Sematech, Albany, N.Y., announces that Air Products and Chemicals, Allentown, Pa., has joined its Front End Processes program, and will work with Sematech to assess advanced materials and technologies for the development of sub-10 nm node III-V devices. Continued scaling will require new materials and chemistries to keep pace with the International Technology Roadmap for Semiconductors.
